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2. ÑîµÀ¹ú£¬£¬£¬ÄªÔÂÖ飬£¬£¬ÄôÒªÒª£¬£¬£¬²ÌÃ磬£¬£¬Áõ¶«¾². ´ó¹¦ÂÊLED·â×°½çÃæ²ãÁѶԽçÃæ´«ÈÈÐÔÄܵÄÓ°ÏìÆÊÎö[J]. µç×ÓÔª¼þÓëÖÊÁÏ, 2016, 35(8): 76-80.
3. ²ÌÃ磬£¬£¬ÑîµÀ¹ú£¬£¬£¬ÄªÔÂÖ飬£¬£¬ÕÅÆ½£¬£¬£¬³ÂÏÔÆ½£¬£¬£¬Á½ÖÖÖÊÁϽçÃæº¬Ô¤ÖÃ΢ÁÑÎÆµÄÑù¼þ¼°ÆäÖÆ±¸ÒªÁ죬£¬£¬ÊÜÌêÍ·ÏÖרÀû£¬£¬£¬2015£¬£¬£¬ÉêÇëºÅ£º201510350534.1£»£»
4. Yuezhu Mo, D.G. Yang, Miao Cai, Dongjing Liu, Yaoyao Nie. Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysis[C]Electronic Packaging Technology (ICEPT), 2016 17th International Conference on.
5. Miao Cai, Daoguo Yang, Yuezhu Mo, Jianlin Huang, Luqiao Yin, Lianqiao Yang, Xianping Chen, Ping Zhang,Guoqi Zhang. Determining the thermal stress limit of LED lamps using highly accelerated decay testing [J], Applied Thermal Engineering. 102(5) (2016) , pp. 1451-1461.
6.ĪÔÂÖé.¡¶»úµçÒ»Ì廯ϵͳÉè¼Æ¡·ÀíÂÛ½ÌѧÓë½ÌѧʵÑéµÄ̽ÌÖ[J]. ÖйúÎ÷²¿¿Æ¼¼, 2018, 17(11): 9-9.